Hochstrom Unimicron Germany Geldern

High Current

Smart Solutions for an Optimal Use of High Current Applications

Unimicron Germany has already been producing PCBs that have to transmit relatively high or very high currents in thick copper technology for many years. We offer progressive solutions even if high currents only need to flow partially on a conventional circuit board.

 

HiCu PCB HR

Thick Copper Technology - HiCU PCB

Thick Copper PCBs are an optimal solution used for the voltage distribution and the management of high current.

Applications:
-   Realisation of power and signal on one board
-   Relay and fuse boxes, DC/DC converter
-   Inverters for renewable energy sources

Advantages:
-  Cost reduction
-  Easy assembly
-  Weight reduction

More details about the range, materials and design rules …

Thick Copper Profile Technology -
HiCu Profile PCB

In HiCu Profile Technology massive copper elements, round and angular, are inserted in the inner cores of multilayer PCBs and then laminated into the PCB.

Applications:
-  Power electronics
-  Current carrying capacity up to 1,000 A
-  Power and logic combined on one board

Advantages:
-  Excellent heat dissipation
-  Combination of logic and power
-  Weight savings and reduction of thickness of PCB

More details about the range, materials and design rules …

HiCu Profile PCB HR
Wirelaid®

Partial Thick Copper Technology - Wirelaid®

In Wirelaid Technology copper wires are applied to the treatment side of a copper foil by micro resistance welding. It can be an cost efficiency alternative to thick copper technology.

Applications:
-  Power electronics
-  High current applications up to 100 A
-  Semiflex version possible

Advantages:
-  Combination of power and logic on one board
-  Optimal heat dissipation
-  Cost reduction

More details about the range, materials and design rules …